The AL120 wafer transfer machine can match silicon and compound wafers with wafer sizes below 200mm, and can safely and efficiently transfer thin wafer wafers, especially suitable for wafer inspection in front-end to back-end engineering projects.
In order to meet the challenge of thinner wafers, Olympus has specially designed transfer arms that allow for the safe transfer and inspection of complete cassette tapes containing 25 200mm wafers, with a thickness of up to 90 microns. The thickness of the wafer can be pre-set through the control panel.
In order to meet the challenge of thinner wafers, Olympus has specially designed transfer arms that allow for the safe transfer and inspection of complete cassette tapes containing 25 200mm wafers, with a thickness of up to 90 microns. The thickness of the wafer can be pre-set through the control panel.