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Discutting machine with grinding wheel
Discutting machine with grinding wheel
Product details
Main purpose:
This machine is mainly used in semiconductor manufacturing for silicon wafers, glass, ferrite, lithium niobate, tantalumCutting or slotting of hard and brittle materials such as lithium oxide, gallium phosphide, gallium arsenide phosphide, and various ceramicsWork.
Main technical features:
The Y-axis adopts rolling guide rails, imported high-density positioning motors, and grating ruler closed-loop control, without errorsAccumulation of differencesSimultaneously install ring light and coaxial light, CCD monitoring and alignment systemSimple and user-friendly interface with automatic tool wear compensation function
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