High quality Leica EM UC7 ultra-thin slicer

The patented concentric mobile stereo microscope system allows for easy alignment and slicing, whether using a glass knife or a diamond knife.
On the basis of the Leica EM UC6 three LED illumination points (ceiling light, backlight light, and sample transparent lighting), two additional LED illumination points are added on both sides of the original ceiling light, which are illuminated by a focused beam for easy observation, cleaning of the blade or freezing of ultra-thin slices.
The slicer can repair blocks independently of the operator, thanks to its unique fully motor-driven cutting table and patented automatic block repair function, achieving automatic block repair and automatic stop.
Ergonomic design allows for comfortable operation regardless of left or right hand habits, making it effortless and fatigue free.
The concentric movement facilitates observation of low water level slices and frozen slices, avoiding damage to health due to poor sitting posture.
Stereoscopic microscopes provide higher magnification.
Touch screen control panel, easy to learn and operate.
Data export allows for the electronic export of user information, sample names, slicing knife information, and slicing storage locations, achieving paperless recording and facilitating communication.
The user identification system facilitates the sharing of instruments among multiple users and can store up to 100 sets of user settings.

Leica EM ACE900 Cryofracture System

Leica EM ACE900 is a high-end sample preparation system.

Perform freeze fracture, freeze etching, and electron beam coating on the sample in one instrument. By using a rotating cryogenic stage and electron beam for high-resolution carbon/metal composite coating, it is suitable for any TEM and SEM analysis and provides flexible projection options.

By using vacuum locks for sample and tool transfer and gate valves to control each electron beam source, the instrument can always maintain a vacuum state, ensuring fast and clean working conditions. This instrument will definitely become an important EM sample processing tool for you.

Leica EM TXP integrated machine

Integrate with the observation system

Observing the entire sample processing process and target area under a microscope, the sample is fixed on the sample cantilever. During the sample processing, the sample can be observed in real time through a stereo microscope. The observation angle can be adjusted from 0 ° to 60 °, or to -30 °, and distance measurement can be performed using an eyepiece ruler. The Leica EMTXP also comes with a bright circular LED light source for optimal visual observation.
>Accurate positioning and sample preparation of small target areas
>In situ observation through stereomicroscope
>Multi functional mechanical processing
>Automated sample processing process control
>Can achieve a mirror like polishing effect
>The brightness of the LED ring light source can be adjusted, and 4 segmented sections are available for selection

Born for microscale sampling

Localization, cutting, grinding, and polishing of small targets at the millimeter and micrometer scales is a challenging task, mainly due to the following difficulties:
>The target is too small to be easily observed
>It is difficult to accurately locate targets or calibrate their angles
>Grinding and polishing to the designated target position often require a lot of manpower and time
>Small targets are easily lost
>The sample size is small and difficult to operate, often requiring embedding and embedding

Integrated Microscopic Observation and Imaging System

Leica M80 stereomicroscope
>Parallel light path design: A parallel light path is formed through the central main objective mirror, with a consistent focal plane
>High resolution: Excellent image quality and stable light intensity at all zoom ratios
>Ergonomic design: optimal comfort for use, without muscle tension or fatigue
Leica IC80 HD Camera*
>Seamless design: Installed between the optical head and binocular tube, no need to add a picture tube or photoelectric tube
>High quality images: coaxial optical path with microscope ensures image quality and obtains non reflective images
>Provide dynamic high-definition images that can be used with or without a computer connection
4-section adjustable brightness LED ring light source
>Illumination from different angles reveals tiny details of the sample

Multiple methods for preparing and processing samples

Samples do not need to be transferred, just switch tools
There is no need to transfer the sample back and forth, simply changing the tool used to process the sample can complete the sample processing process, and the entire sample processing process can be observed in real time through a microscope. For safety reasons, the workshop where the tools and samples are located is equipped with a transparent safety cover, which can prevent the operator from accidentally touching the moving parts during sample processing and also prevent debris from splashing.
LEICA EM TXP can perform the following treatments on samples:
>Milling
>Cutting
>Grinding
>Polishing
>Chong Diamond

Leica EM TIC 3X Three Ion Beam Cutting Instrument

Triple ion beam technology

The three ion beam component is perpendicular to the surface of the sample side, so the sample (fixed on the sample holder) does not need to undergo swinging motion during ion beam bombardment to reduce projection/occlusion effects, which ensures effective heat conduction and reduces thermal deformation of the sample during processing.
technology
The three ion beam converges at the midpoint of the edge of the baffle, forming a 100 ° bombardment fan that is tangential to the sample exposed above the baffle (with the upper end of the sample about 20-100 μ m above the baffle), until the bombardment reaches the target area inside the sample. The newly designed ion gun can generate an ion beam grinding rate of 150 μ m/h (Si10 kV, 3.0 mA, 50 μ m cutting height). Leica's unique three ion beam system can achieve excellent high-quality cutting cross-sections with high speed, wide and deep cutting surfaces, which can greatly save work time. Through this unique technology, high-quality cutting sections can be obtained, with area sizes up to>4 × 1mm

Leica EM TIC 3X - Innovative features in design and operation

High throughput, increasing cost-effectiveness
›› High quality cutting sections can be obtained, with area sizes up to>4 × 1mm
›› Diversified platform design can accommodate three samples in one operation
›› High ion grinding rate, Si material 300 μ m/h, 50 μ m cutting height, can meet laboratory high-throughput requirements
›› Can accommodate a maximum sample size of 50 × 50 × 10mm
›› There are various sample stages that can be used, which are simple, easy to use, and high-precision
›› It can easily and accurately complete the calibration work of installing the sample on the stage and adjusting the relative position with the baffle
›› Simple control through touch screen, no special operation skills required
›› The sample processing process can be monitored in real-time and can be observed through a stereo mirror or HD-TV camera
›› LED lighting for easy observation of samples and position calibration
›› Built in, decoupled design vacuum pump system, providing a vibration free observation field
›› Contrast enhancement can be further performed on the prepared flat cutting section through ion beam etching treatment.
›› Parameters and programs can be uploaded or downloaded via USB
›› Suitable for almost any material sample
›› Using a frozen sample stage, the baffle and sample temperature can be lowered to -150 ° C

A variety of sample platforms

Almost suitable for samples of various sizes and suitable for a wide range of applications. If a sample holder is used, the pre mechanical preparation (Leica EM TXP) to ion beam cutting (Leica EM TIC 3X), as well as SEM microscopy, can be completed, and then placed in a sample storage box for subsequent testing.

Contrast enhancement

After ion beam cutting, there is no need to remove the sample. The same sample stage can also be used to enhance the contrast of the sample, which can strengthen the topological structure (such as grain boundaries) before different phases in the sample

high-precision

Nowadays, the increasingly small details and structures in the samples are gradually attracting people's attention. Obtaining cross-sections through cutting, such as obtaining very small TSVia pore structures, has become effortless. All sample stages are designed to achieve a sample position calibration accuracy of ± 2 μ m. Not only can the control accuracy of the sample stage achieve such precise target positioning calibration work, but the observation system can also observe details of samples with a minimum size of about 3 μ m for accurate target positioning. To facilitate better observation of the sample during positioning, 4-section LED ring light sources or LED coaxial lighting provide great assistance, helping users obtain clear images from body mirrors or HD-TV cameras.
Since the vacuum pump is built inside the instrument, there is no need to create a separate space. Thanks to the decoupling design of the vacuum pump, the observation field is not affected by the vibration interference generated by the vacuum pump during the sample preparation process.

High pressure freezer Leica EM ICE

High pressure freezing can capture the intricate changes in fine structure and cell dynamics.

High pressure freezing combined with light stimulation is the platform for you to discover the mysteries.

Synchronized to millisecond freezing and stimulation can freeze the moment that interests you the most; Freeze and analyze high dynamic processes with nanoscale and millisecond time accuracy; Freeze fix your aqueous sample under high pressure and uncover the secrets of the world.