The system is equipped with ultrafast laser, which can achieve customized depth and material type peeling, etching, cutting and other functions on the surface of polymer materials.
The ultrafast femtosecond laser cutting machine is suitable for micro precision machining of ultra-thin metal copper foil, aluminum foil, stainless steel foil, nickel alloy foil and other materials. It cuts without deformation, black edges, burrs, and high precision; Can be targeted towards flexibilityPI、PET, etcMaterial cutting and etching. Can be targeted towards flexibilityPET、PIEtching, marking, and cutting of coatings on materials or glass or silicon substrates without damaging the substrate. Laser marking, grooving, etching and other treatments can also be directly applied to materials such as glass, silicon wafers, stainless steel, etc., with a minimum line width of less than10Microns.
Product Features
1.Using picosecond or femtosecond lasers, ultra short pulse processing with almost no thermal conduction, suitable for any organic material&High speed cutting and drilling of inorganic materials,minimum3μmThe collapse edge and heat affected zone.
2.CCDVisual pre scan&Automatic target positioning and maximum processing range500×400mm、XYPlatform splicing accuracy ≤±3μm.
3.Excellent beam quality, good long-term stability, and negligible thermal effects.
4. Higher single pulse energy, higher processing accuracy, can achieve fine processing of almost any solid material
5.Excellent processing flexibility, capable of making fine cuts of any shape
6. The independently developed software control system can customize and upgrade various functions according to customer requirements
Applied Materials and Fields
Materials: glass, ceramics, resin, stone, sapphire, silicon, copper, stainless steel, as well as various alloy materials and thin film materials, polymer materials, composite materials, etc.
Application areas: research fields in universities, semiconductor electronics, aerospace, automotive, biomedicine, etc.
Technical Parameter
project |
parameter |
Laser type |
Wavelength:1064/532/355nmFemtoseconds and picoseconds are optional |
Machinable Materials |
Silver pasteITO、CuGlass, sapphire, ceramics, ultra-thin metal sheets Polymer composite materials silicon wafer |
Effective processing range of equipment |
500*400mm(Customizable options) |
focusing lens |
40*40mm/15*15mm(Customizable) |
focusing spot |
5μm(depending on the material) |
Minimum tangent width |
<10μm(depending on the material) |
Thickness of processed products |
≤1.5mm |
Scanning speed of galvanometer |
≤3000mm/s |
Platform movement speed |
500mm/s |
Workbench positioning accuracy |
±2μm |
Workbench repeatability accuracy |
±1μm |
Capable of handling file formats |
standardGerberDocuments,DXFDocuments,PLTDocuments, etc |