1. Rich Runze fully automatic wafer marking equipment, using 5W ultraviolet semiconductor laser for visual positioning.

2. The device is compatible with lithium tantalate and lithium niobate, compatible with 4-inch and 6-inch wafers, and has a wafer thickness of 0.2-0.8mm.

3. The equipment uses a robotic arm to adsorb and transport wafers, meeting the automatic picking and placing of 25 chips in the flower basket (suitable for 4-inch and 6-inch).

4. The device can ensure the accuracy of product labeling and also has OCR detection function.

5. Manual loading and unloading/mechanical arm handling/visual positioning/automatic centering mechanism/photoelectric edge finding mechanism/water cooler/smoke purifier and other functions.