Technical parameters of HD-1400S mold core repair polishing machine

This equipment is mainly used for surface grinding and polishing of non-metallic and metallic hard and brittle materials, thin precision parts such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials. Consult details now:

　　1.Main accuracy:The surface roughness is above 0.4um and the flatness is within 0.008/100mm.

　　2.Machine tool material:The machine tool bed is made of cast iron (or high steel welding) technology, with good material quality, high strength, and good stability.

　　3.Electrical system:Imported electrical components are used, which are not affected by mechanical vibration and electrical interference and have good moisture resistance. To provide better grinding efficiency and a wider range of grinding process options for grinding workpieces.

　　4.Grinding disc movement form:Adopting variable frequency speed regulation and full chain wheel transmission, the whole machine starts smoothly and runs stably, especially at low speeds, overcoming the phenomenon of grinding disc movement and crawling.

　　5.Machine tool application power:Adopting dual motors and dual frequency conversion drive, the main motor (11KW/1440r/min) drives the grinding disc, and the auxiliary motor (4KW/1440r/min) drives the internal teeth, both of which can be adjusted in speed.

6. Equipped with a grinding fluid stirring and filtering system, greatly improving the utilization rate of grinding fluid.

7. Innovation is the fundamental concept of design. During the design process, this equipment carefully analyzed and compared the structural, control, and functional characteristics of similar devices at home and abroad, and comprehensively summarized and adopted the successful experience and reasonable suggestions of numerous users. Efforts should be made to improve the technical content, operational accuracy, and smoothness of the equipment.

　　8. For more specifications and grinding methods, please contact us.

HD-1400S mold core repair polishing machine processing case:

Non metallic and metallic hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials. (It is recommended to buy more equipment and have Heide send the process; for less quantity, find Heide to process on your behalf.)

Note: Due to continuous technological updates, the above data is for reference only and subject to physical data in the end!