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Heidelberg Laser Direct Writing System from Germany
Heidelberg Instruments (HIMT) is located in Heidelberg, Germany. Founded in 1984, HIMT mainly produces high-precision Heidelberg laser direct writing
Product details
The German Heidelberg Laser Direct Writing System - DWL66 Laser Direct Writing Light Painting System is a machine designed by Heidelberg considering the concept of low cost investment and increased interaction with customers. Although the price is not high, it still maintains high-precision light painting quality and has gained considerable satisfaction from customers in the research and development of lithography technology and optics. Simultaneously resuming orders and continuously increasing them further proves the design and development philosophy of the DWL66 system, which enhances high added value with minimal cost.
Technical parameters:
Processing part size: 150X150mm
PaintingHeadline focal lengthWrite Lens |
10 mm |
20 mm |
40 mm |
||
*Small line width or spacingMinimum Feature |
0.6um |
1µm |
2.5 µm |
5 µm |
10 µm |
Writing GridWrite Grid |
20nm |
40 nm |
100 nm |
200 nm |
400 nm |
CDUniformityCD Uniformity |
80nm |
100 nm |
220 nm |
440 nm |
880 nm |
Line width uniformityLine width Uniformity |
100 nm |
200 nm |
400 nm |
600 nm |
1000 nm |
Line edge roughnessEdge Roughness |
60 nm |
80 nm |
120 nm |
180 nm |
280 nm |
Alignment accuracyAlignment Accuracy |
200 nm |
250 nm |
500 nm |
1 µm |
2 µm |
positioning accuracyPosition Accuracy |
0.4 um |
0.6 µm |
1 µm |
1.5 µm |
2 µm |
Read and write timeWriting time ( 80x |
70 hour |
19 hour |
3 hour |
0.9 hour |
0.3 hour |
ApplicationsApplication scope
This laser pattern generation system is used for various substrates, glass, silicon wafers, or other planar materials coated with photoresist.
RETICLE(dividing board),ASICS(Chip),MEMS(Micro Electro Mechanical Systems),SENSOR(Sensor),
REFRACTIVE OR DIFFRACTIVE OPTICS(Refractive and diffractive optics), MOEMS(Micro electromechanical system),
MCMS, HYBRIDS, INTEGRETED OPTICS(Integrated Optics), µTAS，SAW ect.
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