CMI760 Dual Function Hole Copper Thickness Gauge

CMI760 uses micro resistance (SRP-4) and eddy current (ETP) methods to measure the thickness of surface copper and copper plating inside holes. It has multifunctionality, high scalability, and advanced statistical functions.

SRP-4 probe features:

Apply advanced micro resistance testing technology. The tethered probe consists of four probes, with AB as the positive electrode and CD as the negative electrode; When measuring, there will be a small resistance in the current from the positive pole to the negative pole. The surface copper thickness can be accurately and reliably obtained through the functional relationship between the resistance value and the thickness value, without being affected by the insulation board layer and the copper layer on the back of the circuit board. The worn SRP-4 probe can be replaced by itself and is a patented product of Oxford Instruments. The illumination function and protective cover of the probe facilitate accurate positioning during measurement.

Characteristics of ETP probe:

Apply eddy current testing technology. When measuring, the probe releases electromagnetic waves. When the magnetic field cuts the metal layer, a change in the magnetic field occurs. By calculating this change, the copper thickness of the hole wall can be determined. The measurement is not affected by the inner layer of the board, even for double-layer or multi-layer boards, and can still work well even with tin or tin/lead protective layers. In addition, the probe adopts temperature compensation technology, which can measure the thickness of copper holes even for plates that have just been taken out of the plating tank.