InSEM HTMeasure the hardness, modulus, and hardness at high temperatures by separately heating the tip and sample in a vacuum environment.INSEM®HTScanning Electron Microscopy（SEM）Focused ion beam（FIB）Or compatible with independent vacuum chambers. peripheralInViewSoftware can assist in developing new experiments. Scientific publications indicate that,InSEM HTThe results are consistent with traditional large-scale high-temperature test data. The wide temperature range enablesInSEM HTBecoming a highly valuable tool for developing research materials.

major function

Continuous stiffness measurement（CSM）

CSMThe technology involves measuring the mechanical properties as a function of depth, force, time, or frequency during the indentation process. This scheme adopts constant strain rate testing to measure hardness and modulus as functions of depth or load, which is the most commonly used testing method in academia and industry.CSMIt is also used for other advanced tests, including storage and loss modulus measurementProbeDMA™Method andAccuFilm™Independent measurement of the substrate.CSMIntegrated into the controller andInViewIn software, it provides unparalleled ease of use and data quality.

NanoBlitz3D

NanoBlitz 3DutilizeInforcefiftyThe loader uses a Bose indenter to measure heightE（>3Gpa）The three-dimensional measurement diagram of the material.NanoBlitz1The indentation is less thanPoints/ s10At mostTen thousand impressions（300x300The array provides the Young's modulus, hardness, and stiffness of each indentation under load, and extensive testing improves statistical accuracy.NanoBlitz 3D

It also provides visualization software and data processing functions.AccuFilm™

Thin film method packageAccuFilm™The thin film method package is based onHay-CrawfordA new testing method for the model, using continuous stiffness measurement（CSM）Measure the independent characteristics of the substrate material.AccuFilm™

Corrected the influence of the substrate on the measurement of hard films on soft substrates and soft films on hard substrates.ProbeDMA™

Polymer method packagePolymer packaging can measure the modulus of polymers as a function of frequency. This test includes a flat punch, viscoelastic reference material, and a test method for evaluating viscoelastic properties. This measurement technique is a key technology for characterizing nano polymers and polymer films, while traditional methodsDMA

The testing equipment cannot test these films well.

Scratch and Wear Test Function

The scratch test applies a constant or inclined load to the indenter when passing through the surface of the sample at a specified speed. Scratch testing can characterize many material systems, such as thin films, fragile ceramics, and polymers.

DataBurstDataBurstintegrationInViewSoftware andInQuestController system, using greater than1kHz

Record displacement data at a certain rate to measure sudden changes in high strain jump loads in experiments. Especially suitable for testing experiments that collect large amounts of data in the event of instantaneous fracture or compression explosion.Gemini 2D

Multi axis sensor Gemini 2D