Triple ion beam technology

The three ion beam component is perpendicular to the surface of the sample side, so the sample (fixed on the sample holder) does not need to undergo swinging motion during ion beam bombardment to reduce projection/occlusion effects, which ensures effective heat conduction and reduces thermal deformation of the sample during processing.
technology
The three ion beam converges at the midpoint of the edge of the baffle, forming a 100 ° bombardment fan that is tangential to the sample exposed above the baffle (with the upper end of the sample about 20-100 μ m above the baffle), until the bombardment reaches the target area inside the sample. The newly designed ion gun can generate an ion beam grinding rate of 300 μ m/h (Si10 kV, 3.0 mA, 50 μ m cutting height). Leica's unique three ion beam system can achieve excellent high-quality cutting cross-sections with high speed, wide and deep cutting surfaces, which can greatly save work time. Through this unique technology, high-quality cutting sections can be obtained, with area sizes up to>4 × 1mm

Leica EM TIC 3X - Innovative features in design and operation

High throughput, increasing cost-effectiveness
›› High quality cutting sections can be obtained, with area sizes up to>4 × 1mm
›› Diversified platform design can accommodate three samples in one operation
›› High ion grinding rate, Si material 300 μ m/h, 50 μ m cutting height, can meet laboratory high-throughput requirements
›› Can accommodate a maximum sample size of 50 × 50 × 10mm
›› There are various sample stages that can be used, which are simple, easy to use, and high-precision
›› It can easily and accurately complete the calibration work of installing the sample on the stage and adjusting the relative position with the baffle
›› Simple control through touch screen, no special operation skills required
›› The sample processing process can be monitored in real-time and can be observed through a stereo mirror or HD-TV camera
›› LED lighting for easy observation of samples and position calibration
›› Built in, decoupled design vacuum pump system, providing a vibration free observation field
›› Contrast enhancement can be further performed on the prepared flat cutting section through ion beam etching treatment.
›› Parameters and programs can be uploaded or downloaded via USB
›› Suitable for almost any material sample
›› Using a frozen sample stage, the baffle and sample temperature can be lowered to -150 ° C

A variety of sample platforms

Almost suitable for samples of various sizes and suitable for a wide range of applications. If a sample holder is used, the pre mechanical preparation (Leica EM TXP) to ion beam cutting (Leica EM TIC 3X), as well as SEM microscopy, can be completed, and then placed in a sample storage box for subsequent testing.

Contrast enhancement

After ion beam cutting, there is no need to remove the sample. The same sample stage can also be used to enhance the contrast of the sample, which can strengthen the topological structure (such as grain boundaries) before different phases in the sample

high-precision

Nowadays, the increasingly small details and structures in the samples are gradually attracting people's attention. Obtaining cross-sections through cutting, such as obtaining very small TSVia pore structures, has become effortless. All sample stages are designed to achieve a sample position calibration accuracy of ± 2 μ m. Not only can the control accuracy of the sample stage achieve such precise target positioning calibration work, but the observation system can also observe details of samples with a minimum size of about 3 μ m for accurate target positioning. To facilitate better observation of the sample during positioning, 4-section LED ring light sources or LED coaxial lighting provide great assistance, helping users obtain clear images from body mirrors or HD-TV cameras.
Since the vacuum pump is built inside the instrument, there is no need to create a separate space. Thanks to the decoupling design of the vacuum pump, the observation field is not affected by the vibration interference generated by the vacuum pump during the sample preparation process.