Leica Room Temperature/The frozen ultra-thin slicer series is mainly used for TEM, and can cut samples involving plastics, rubber, high molecular polymers, soft metals, biological samples, and food, etc. Leica ion beam thinning instrument is mainly used for TEM, and can usually obtain stress free thinning thin films for inorganic solid materials such as steel materials, metal materials, multilayer film materials, microelectronics and composite materials, etc; Ion beam cutting instrument, used for SEM, can obtain stress free "cutting" sections
ObtainableTEM ultra-thin sections, flat surfaces of AFM or SEM, and semi thin sections for LM or FT-IR analysis
Built in shock absorption function, combined with gravity slicing system and high tightness bearing system
Injection method: automatic, sample advance range:200μm
Slicing method: automatic, slicing speed:0.05-100mm/s
Slice thickness setting:1nm-15 μ m, with a small step size of 1nm
Knife Tai moves forward, backward, left, and right with fully automatic motor control. The distance of forward and backward movement is:10mm； Left and right movement distance: 25mm
Slicing knife tilt range:-2 ° to 15 °
4 independently controlled LED lighting systems
Color touch screen control panel, fast and safe operation; Can record and retrieve slice parameters