OmniScan X3 phased array flaw detector

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Product Introduction

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OmniScan X3Phased array flaw detector

Full of confidence, clearly visible

RebuiltOmniScan

Nowadays, the main members of the phased array inspection team are even more outstanding! The OmniScan flaw detector once stood out as a benchmark instrument in the field of portable phased array worldwide due to its reliable results, clear images, and easy use. Now, this instrument has added powerful features such as fully focused mode (TFM) imaging, allowing users to complete detection work with more confidence.

If you have used the OmniScan instrument before, you will have a very familiar feeling about the OmniScan X3 flaw detector: it still retains its highly portable features and sturdy casing suitable for industrial environments, but its user interface is simpler, clearer, and more modern. If you have never used this instrument before, you will soon discover why OmniScan can become a benchmark instrument that is popular and trusted by testing personnel around the world.

Basic characteristics

• Airborne TOFD (Time of Flight Diffraction) function

• 2 UT channels

• Meets IP65 rating standard through drop testing

• 8 sets of sound beam settings

• Compatible with existing Olympus scanners and probes

• 16: 128PR configuration or 32:128PR configuration

• Compliant with ISO 18563-1:2015 and EN12668-1:2010

Innovative features that can enhance efficiency

• The Full Matrix Capture (FMC) function enables the acquisition of Full Focusing Method (TFM) images (supporting apertures of 64 chips)

• 4 GB of large file capacity, 64 GB of memory

• Carefully designed software greatly reduces the number of keystrokes

• Create the entire scanning plan in a single workflow

• Quickly collect calibrated envelope lines through the "single scan" method

• 1024 focusing rules

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From start to finish, more effective detection can be achieved

Get back to work immediately

The comprehensive airborne scanning plan tool function, once enabled, can help users observe the detected images before the detection begins. If users miss certain information in the scanning plan, these visualization tools will detect such errors in advance, thereby reducing the risk of errors. Users can create the entire scanning plan, including the TFM area, in a simple workflow. The improved calibration and setting verification tools enable users to quickly complete the creation of detection settings and put them into detection work as soon as possible.

Faster completion of setup tasks

• Multiple probes/groups can be configured at once

• Create settings for twin crystal linear, matrix, and double matrix arrays on the instrument

• Automatic wedge verification

• Single scan calibration

• Using simultaneous multi-point time correction gain (TCG) for data acquisition

• Simplified calibration verification process for saved settings

Better quality images can give users more confidence in interpreting defect indication signals

Clearer phased array images help users more confidently interpret signal indications. By using the TFM function, users can obtain clearer images of various parts of the entire volume of the workpiece, and fuse these images together to generate images that accurately reflect the geometric shape of the workpiece. This allows users to verify the defect characteristics obtained using conventional phased array technology. Up to 64 activated chips can be used for full matrix capture operations to greatly increase the coverage area of the fully focused mode (TFM) and optimize the detection resolution.

Other functions, including 16 bit A-scan, interpolation, and smoothing, can improve the quality of phased array imaging, thereby enabling more effective defect scanning work.

Testing tools and instruments provided

• Quickly access the required functions, even during the detection process

Efficient menu structure means detection can be completed without multiple button presses

• Combining high performance and versatility: Expert level features can be accessed using advanced mode when needed

• Use Olympus Science Cloud System (OSC) to send data wirelessly or share screens with colleagues outside the testing site

• Supports dual crystal linear/dual crystal matrix array probes, dynamic depth focusing, automatic cursor positioning, and more other functions

4 GB of onboard file capacity can help users scan larger components without the need for segmented scanning or data uninstallation

The built-in GPS function can track the location where the detection results are obtained

Faster analysis and faster results acquisition

The time required for analyzing phased array data may be longer than the time required for detection. The OmniScan X3 flaw detector provides users with some flexible and easy-to-use tools. With these tools, users can analyze data faster whether using instruments or PCs. By using improved defect reports and more export options such as SD cards, USB storage, and cloud systems, users can easily communicate comprehensive inspection results, including scan plans and defect quantification, with others.

Data interpretation tool

Weld seam gates can reduce the impact of echoes from irregular geometric shapes

The volume top view and volume side view can be fused together, and geometric data can be corrected to highlight defects

The automatic cursor positioning function can mark the position of the point where the peak amplitude of the indicator signal has decreased by -6 dB, saving time in locating the cursor

Third party programs can be connected to the Olympus Science Cloud system, so users can access detection data using their favorite analysis programs

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Main members of the testing team

The OmniScan X3 flaw detector has powerful detection performance and high flexibility, which can meet the challenges posed by phased array detection. Whether you are inspecting welds, pipelines, pressure vessels, or composite materials, the OmniScan X3 instrument can provide you with suitable functions to help you effectively complete the inspection work and confidently interpret defect data.

weld line

• Check if the weld seam area can be correctly covered by setting the view through multiple sets of sound beams

• The amplitude range can be extended to 800%, so users do not need to scan the components again to characterize saturated indicator signals, such as unfused indicator signals.

• Support multiple probe configurations and different triggering schemes to better cover each weld area

• Weld gate can highlight the areas that need attention

corrosion

• High collection speed makes it easier to detect larger pipelines or containers

• 4 GB of single file capacity can reduce the number of interrupt operations and collect more data

• Compatible with all Olympus corrosion scanners

• Supports dual crystal linear array probes, enabling improved near surface resolution

compound material

• High amplitude range (800%) and 16 bit digital converter can achieve a wider dynamic detection range when detecting materials with strong attenuation

• The dynamic range of TCG can reach 65 dB, and it provides an improved TCG table view for manual editing of various points

• A scanning speed of 12 kHz can quickly collect data in larger scanning areas

• Control the wide pulse width to optimize the use of low-frequency probes

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Reliable performance, trustworthy

If you test your assets outdoors, the testing tools may get wet, heat up, and even fall off. That's why we pay extra attention to the durability of the OmniScan X3 flaw detector, and our OmniScan X3 has passed rigorous durability testing. This instrument meets the IP65 dustproof and waterproof rating requirements and has passed the test of falling from a height of 4 feet. When you are ready for testing, this instrument can be put into operation immediately. The 10.6-inch WXGA large display screen can provide clear and visible images in most lighting conditions, and operators can also perform simple touch screen operations, even when wearing gloves, applying coupling agents, or other difficult conditions. In high-temperature environments, easily replaceable cooling fans can be used to maintain the operating temperature within the range of -10 ° C to 45 ° C without compromising the instrument's performance in accordance with IP65 rating standards.

Experience the powerful performance of cloud systems

• The wireless connectivity capability of connecting data to the Olympus Science Cloud system enables users to collaborate more effectively and seamlessly manage phased array data.

• Share instrument screens with colleagues for guidance, advice, or different opinions

• Upload data to the cloud system for access from any location

• Save detection settings files in the cloud system to access them when needed, or deploy them to relevant projects through the hub of Olympus Science Cloud System

• Accessing calibration and authentication files in cloud systems

• Wireless firmware updates help ensure users receive new software and features

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technical specifications

type	Multi beam setup, multi-mode ultrasonic flaw detector
Power supply	18 V，3.9 A
size (Width x Height x Thickness)	330 mm × 215 mm × 142 mm
weight	5.7 kg (with 1 battery)
Hard drive capacity	8 GB DDR（RAM）； 64 GB SSD
storage device	SDHC cards and SDXC cards, or most standard USB storage devices
Maximum onboard file capacity	4 GB
GPS	Yes (unless otherwise specified for certain regions)
call the police	3 of them
Wireless connection	Yes (USB adapter sold separately as an accessory)
PA interface	1 interface
Number of sound beam settings	8 sound beam settings, 1024 focusing rules
UT interface	4 (2 channels P/R)
authentication	ISO 18563‑1:2015 EN12668‑1:2010
display
technology	Resistive touch screen
size	269 millimeters (10.6 inches)
resolving power	1280 × 768 pixels
Color Quantity	16 million
type	Thin film transistor liquid crystal display (TFT LCD)
viewing angle	Level: - 85° ～ 85° Vertical: - 85° ～ 85°
Input/Output (I/O) ports
USB 2.0	2 ports (1 located behind the battery)
USB 3.0	1 port
Video output	Video output (HDMI)
Memory card	SDHC port
communication	Ethernet
Input/Output (I/O) Line
encoder	Dual axis encoder line (orthogonal or clock/direction)
Digital input	6 numerical inputs, TTL
Digital output	5 digital outputs, TTL
Collection switch	Configure 1 digit input as the acquisition switch
Power output line	5 V rated, 1 A (short circuit protection), 12 V output at 1 A
External DC power supply
Direct current input (DC-IN) voltage	15 VDC to 18 VDC (minimum 50 W)
Interface	Circular, 2.5mm pin diameter, center positive pole
Battery
type	Lithium ion battery
capacity	93 Wh
Number of batteries	2 of them
Running time	2 batteries run for 5 hours (with hot swappable performance)
PA/UT configuration
frequency	Digital frequency	100 MHz
	Maximum PRF	12 kHz
display	Refresh rate	A-scan: 60 Hz; S-scan: 20 Hz to 30 Hz
	envelope (Echo Dynamic Mode)	Yes: Volume corrected S-scan (30 Hz)
	A-scan height	Up to 800%
synchronization	According to the internal clock	1 Hz ～ 10 kHz
	External constant speed	have
	According to the encoder	Dual axis: 1 step to 65536 steps

Data Technical Specifications
handle	The maximum number of scanned data points for A	Up to 16384
	Real time average	PA：2、4、8、16 UT：2、4、8、16、32、64
	detection	RF, full wave, positive half wave, negative half wave
	wave filtering	PA channel: 3 low-pass, 6 band-pass, 4 high pass filters UT channel: 3 low-pass, 6 band-pass, 4 high pass filters (Three low-pass filters in TOFD configuration)
	Video filtering	Smooth (adjusted according to the frequency range of the probe)
Programmable TCG	Number of points	32, each focusing rule has a TCG (Time Correction Gain) curve.
	Range	Phased array (standard): 40 dB, step size 0.1 dB Phased array (extended): 65 dB, step size 0.1 dB Conventional ultrasound: 100 dB, step size 0.1 dB
	Maximum slope	Phased array (standard): 40 dB/10 ns Phased array (extended): 0.1 dB/10 ns Conventional ultrasound: 40 dB/10 ns
Acoustic Technical Specifications
		PA channel	UT channel
Pulse generator	Voltage	40 V, 80 V, 115 V	95 V, 175 V, 340 V
	pulse width	Adjustable within the range of 30 ns to 500 ns, with a resolution of 2.5 ns	Adjustable within the range of 30 ns to 1000 ns, with a resolution of 2.5 ns
	Descent time	< 10 ns	< 10 ns
	Pulse shape	Negative square wave pulse	Negative square wave pulse
	Output impedance	Pulse echo: 35 Ω One send, one receive: 30 Ω	< 30 Ω
receiver	Gain range	0 dB to 80 dB, maximum input signal; 550 mVp-p (full screen height)	0 dB to 120 dB, maximum input signal; 34.5 Vp-p (full screen height)
	Input impedance	Pulse echo mode, 9 MHz Time: 57 Ω± 10%	The pulse echo mode is 60 Ω, and the pulse transmission and reception mode is 50 Ω
	Input impedance	One send one receive mode, 9 MHz At 100 Ω± 10%
	System bandwidth	0.5 MHz ～ 18 MHz	0.25 MHz ～ 28 MHz
Sound beam formation	Scan type	Single, linear, fan-shaped, hybrid, and fully focused modes (TFM)	‑
	aperture	OMNIX3‑PA16128PR = 16 chips OMNIX3- PA32128PR= 32 chips	‑
	Number of chips	OMNIX3‑PA16128PR = 16 chips OMNIX3- PA32128PR= 32 chips	‑
	The number of focusing rules	1024 pieces	‑
	Delay range of launch	0 µ s to 10 µ s, increments of 2.5 ns	‑
	Delay range of reception	0 µ s to 6.4 µ s, increments of 2.5 ns	‑
TFM (Full Focus Mode)/FMC (Full Matrix Acquisition)
Supported modes	LL、LLL、LLLL、 TT、TTT、TTTT、 LTT、TLT、TLL
Parallel multi-mode full focus mode （TFM）	have
Number of sound beam settings	2 sound beam settings
Maximum aperture	64 chip extended aperture
Image resolution	Up to 1024 × 1024 (1 million points)
Operating environment
Intrusion protection rating	Compliant with IP65 rating standard (Completely dust-proof and resistant to water jets from all directions, 6.3mm nozzle).
Anti collision rating	Through MIL-STD-810G drop test
Expected use	Indoor and outdoor use
Altitude	Up to 2000 meters
working temperature	‑10 °C ～ 45 °C
Storage temperature	-20 ° C to 60 ° C (with built-in battery) -20 ° C to 70 ° C (without battery installed)
Maximum relative humidity (RH)	Maximum relative humidity of 70% at 45 ° C without condensation
class of pollution	Level 2
Installation/overvoltage category	Class II