Pulsed laser deposition（PLD）It is a universal process used for thin film deposition, with the main advantage of transferring materials from the target to the substrate according to stoichiometry.SURFACE PLD-WorkstationIt is an excellent prototype design and research system for thin films, which can easily obtain new materials, especially complex oxide layers.

PLD-WorkstationsupportPLDAll components of the system (including laser and laser gas supply) are integrated into one framework. The compact design makes the system the most flexible to use and avoids many hardware installation tasks. All of these are the key to unparalleled versatility, even for those withoutPLDUsers with technical experience can also use itPLDEquipment!

PLD-WorkstationProvide advanced sedimentation technology with a powerful and compact design-Suitable for a wide range of applications. It not only has the advantage of built-in flexibility, but also unparalleled security:

ŸFully enclosed laser beam line, externally driven mirror adjustment, can safely prevent ultraviolet laser radiation;

ŸThe laser and laser gas holder are connected to the external exhaust pipe.

2、 Function

lFEATURES

Integrated solution for fast processing“plug and play”install

Advanced process automation, also applicable to superlattice deposition

Oxygen resistant substrate heater, with1000°CHigh temperature measurement function

Optionally provide laser heating for the substrate

Flexible advanced robotic arm with cross contamination shielding function

Vacuum chamber prepared for system upgrade（RHEEDPlasma source,OES / FTIR，...）

SURFACE Fluence ControlOptions available for obtaining100%Repeatable results

Fully enclosed beamline, worry free, safe operation

lVacuum chamber: Built in flexibility

The vacuum chamber is designed specifically for research purposes. It has spare flanges suitable for the most common in-situ analysis tools or other system extensions:

ŸOptical analysis methods:OESperhapsFTIR

Ÿ RHEED

Ÿmass spectrum

ŸAdditional deposition or plasma sources

In addition, the two windows allow for observation of the sedimentation process from two different angles and two sides. Main process components: target material and substrate manipulator. Standard configuration provided2“Substrate heater and4×2”Built in target material manipulator.

In order to regulate the process conditions, two mass flow controller channels for supplying process gas into the chamber are standard. They can automatically control the process atmosphere and pressure.

The laser beam will impact each point of the target material at two different incident angles, so it does not affect the stoichiometry of the ablated material. To achieve uniform deposition of target material, two different target material motion modes can be used:

Switching: The target conveyor belt moves back and forth in a continuous motion so that the laser beam hits the target material at any radius from the center of the target. This mode is easy to set, only the diameter of the target material needs to be known.

Scanning: Move the target conveyor belt to make the laser beam on the target material“write”Defined orbit. Adjusting the target rotation speed and track spacing to match the laser spot size and repetition rate achieved uniform deposition of the target material.

lPLD-LabMultiple chambers, one laser

If more throughput is needed, multiplePLDCombine workstations into a system that shares a laser. Extended beamline with automatic reflector to guide the laser beam to the desired directionPLDWorkstation room. The laser server computer automatically controls the laser and beamline based on demand, andPLDThe deposition process in the chamber is delayed until the laser is available for a specific chamber.

lTechnical Parameter

Laser: relatedCOMPexPro 201Fperhaps205FMaximum pulse energy0.7 J；

Wavelength:KrF 248nm

Pressure control: 2individualMFCChannel, automatic pressure control

Substrate heater: diameter1“perhaps2”，1000°C(Other sizes available upon request) or laser heater

Substrate rotation: 0arrive50 rpm

Target material:4×2“Target rotation（0-50 rpm）Uniform sedimentation with track control position

Control system: be based onPCControl and integrationTFTmonitor

ITFunction:LANconnect,SURFWAREsupport software

Size: make an appointment2200×850×1600mm³

3、 Application

ŸJosephson junctions

Ÿ PZTfilm

ŸMetal and complex metal oxides