The multi station rotating laser marking platform can achieve functions such as laser marking, drilling, etching, cutting, etc. It can replace different types of lasers according to product processing needs, with strong functionality and strong expandability.
Product Features
The multi station rotating laser marking platform can achieve functions such as laser marking, drilling, etching, cutting, etc. It can replace different types of lasers at any time and has strong functionality and expandability. Multiple workstations have been configured to interface with assembly line operations, achieving large-scale production and processing needs.
Configure multi station rotary processing to achieve functions such as loading, identification, processing, testing, data uploading, and unloading, and to track product quality. The entire production cycle is controlled within5Within seconds (depending on the laser processing content).
The highlight of the equipment is that it automatically determines whether the processed product is qualified after processing, and can monitor the processing quality of the product in real time on the computer, achieving product quality control and traceability.
The integrated body is more beautiful and space saving, and the entire laser processing area is completely enclosed with strong protective performance. The laser adopts imported air-cooled laser, no water tank, small footprint, energy-saving and more stable.
Rotating multi station laser marking platform, production cycle time ≥12piece/Minutes, including loading, rotation, and processing time, with a fast and stable production rhythm.
Equipment parameters
wavelength |
355nm(Optional) |
Laser head output power |
5W / 30KHz(Optional) |
repetitive frequency |
10-200KHz |
Scope |
100mm×100mm(optional) |
Mark line width |
≤0.01mm |
Mark depth |
≤0.01mm |
Minimum character |
0.06mm |
Marking line speed |
>7000mm/s |
Power demand |
220V/single phase/50Hz/60Hz/16A |
Whole machine power |
2KW |