SUME

BW510 is a semi-automatic wafer bonding equipment used for research and development or small batch production. It has a unique structural design with good pressure and temperature uniformity to ensure that the bonding pressure plate is relatively horizontal. It has advanced vacuum system and chamber design, convenient and concise menu editing, equipment status monitoring, and safety protection functions. SUMEBW510 is compatible with most product circle sizes, with an open cavity design for easy maintenance and conversion to different specifications. It has a small footprint and complete functions.
Equipment advantages
High vacuum bonding chamber; Faster heating and vacuuming to increase production capacity; Single chip up to 200mm product; Compatible with experiments and production;
The program runs automatically;

Better cost control.