The device is suitable for high-speed laser etching and stripping of conductive materials on Glass substrates. The equipment is equipped with a 3200mm × 2400mm ultra large format stage, which can handle ultra large format workpieces, perform automatic image positioning and automatic high-speed laser etching processing. This device carries automatic positioning laser marking QR code, QR code reading function, and can also achieve integrated product quality traceability.
Product Features
1.Laser etching is a dry etching process with a simple manufacturing process. All processing is automatically controlled by software, resulting in high product consistency and a yield rate of up to 99%. It is consumable free, environmentally friendly, reliable, and stable.
2.CCDThe camera automatically locates and has high processing accuracy.
3.The equipment is easy to operate, the drawing file is updated conveniently, the process is shortened, and the utilization rate is high.
4.The device control software can achieve automatic image segmentation, mobile splicing processing, and splicing accuracy up to ± 3 μ m
5.Low power consumption, fewer operators, no pollution, and low production costs.
Applicable materials
Indium tin oxide (ITO) on glass surface, silver paste (Ag), carbon nanotubes (CNT), graphene, nano silver, molybdenum aluminum molybdenum, copper, polymer conductive film, aluminum thin film PERC、 Ultra fine line wide laser etching of coating materials such as perovskite cells, zinc oxide, FTO, TCO, etc.
Application industry
1.Touchscreen GF for mobile phones, cars, tablets, smart wearables, ordering machines, etc, GFF,OGS。
2.Etching of conductive film layer on OGS of car touch screen body.
3.Thin film solar cells, photovoltaic industry.
4.Emerging energy industry.
5.Luminescent glass and display glass industry.
6.Other display screens.
Technical Parameter
laser device |
fiber laser |
Green Laser |
wavelength |
1064nm |
532nm |
Laser power |
20W |
10W |
Minimum focused spot |
<0.02mm |
|
Etching line width |
5-100μmAdjustable (depending on the material and laser) |
|
Etching speed |
<4000mm/s |
|
Processing scope |
3200*2400mm(Customizable according to customer requirements) |
|
Maximum single format |
110mmX110mm (Optional) |
|
CCDAutomatic positioning accuracy |
±3μm |
|
Positioning accuracy of linear motor worktable |
±2μm |
|
Repetitive accuracy of linear motor worktable |
±1um |
|
Equipment weight |
6000kg |
|
Capable of handling file formats |
Standard Gerber files, DXF files, PLT files, etc |