The VCA-3000S wafer surface analysis system is designed to manage the quality of semiconductor material wafer production and processing. The system software can quickly perform contact angle/surface kinetic energy analysis on the chip surface to evaluate adhesion, cleanliness, and coating.

The organization of the syringe can be improved, which is beneficial for loading and unloading, and reduces the probability of chip damage.

Although the system software is designed for wafer surface analysis, it is an effective specialized tool for all applications that require large-scale work. The system software can easily accommodate samples with specifications up to W12 "x L12" x H.75 ".

The VCA 3000 uses high-precision cameras and excellent PC technology to capture static data or daily dynamic images of liquids, and clearly identifies broken lines in contact angle measurements. Manual or fully automatic injectors can conveniently dispense experimental liquids. The computer operation caused human factors to be incorrect when drawing wireframes, and captured daily dynamic images for time sensitive analysis. Statistical data and images are stored on the computer for future analysis or easy transfer to third-party mobile applications.