The thermal characteristics (thermal resistance) evaluation of power semiconductor substrates and materials is carried out using methods that comply with ISO4825-1:2023. The thermal characteristics evaluation and analysis equipment for power semiconductor mounting substrates (TE100) is used for measurement

characteristic:

1. Evaluation device for thermal characteristics (thermal resistance) of power device substrates.

2. Quick testing/analysis capabilities;

3. The heat dissipation characteristics can be evaluated using an evaluation module structure that complies with ISO4825-1:2023.

4. Able to evaluate the heat dissipation characteristics caused by the module structure.

5. Simulate the heating of power chips through self-developed SiC chips;

6. Able to measure and evaluate the heat dissipation characteristics of individual substrate materials.

The TEG chip uses a platinum probe to ensure the accuracy and stability of temperature measurement results;

Power semiconductors, such as automotive, electrical, and railway applications. It contributes to the high thermal conductivity design of semiconductors. It can be applied to ceramic substrates, heat transfer materials, heat sinks, and other power semiconductor components.

The TEG chip is attached to a sample for evaluation, such as a metalized substrate: